Relife flux paste RL223-OR

RELIFE RL-223-OR is a lead free high quality solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.

Features
Lead free and no residue.
Features high viscosity and high activity.
Provides quick and high-quality tinning with a minimum amount of smoke.

Technical Specifications
Net weight 100 g
Package Dimensions 65 × 75 × 60 mm

Package Contents
Solder Paste RELIFE RL-223-OR (100 g) — 1 pc.