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WL HT007 Intelligent Mainboard Layered Soldering Station Preheater for iPhone X To 15 Pro Max

WL HT007 Intelligent Mainboard Layered Soldering Station Preheater for iPhone X To 15 Pro Max
WL HT007 Intelligent Mainboard Layered Soldering Station Preheater for iPhone X To 15 Pro Max
WL HT007 Intelligent Mainboard Layered Soldering Station Preheater for iPhone X To 15 Pro Max
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WL HT007 Intelligent Mainboard Layered Soldering Station Preheater for iPhone X To 15 Pro Max
WL HT007 Intelligent Mainboard Layered Soldering Station Preheater for iPhone X To 15 Pro Max
WL HT007 Intelligent Mainboard Layered Soldering Station Preheater for iPhone X To 15 Pro Max
WL HT007 Intelligent Mainboard Layered Soldering Station Preheater for iPhone X To 15 Pro Max
  • Stock: In Stock
  • Model: WL HT007
  • Weight: 4.00kg
People Interested: 614
Rs.25,999
Ex Tax: Rs.25,999

WL HT007 Intelligent Mainboard Layered Soldering Station for iPhone X-15 Pro Max. WL HT007 Preheating Desoldering Station for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max/14/14Pro/14Pro Max/15/15Plus/15 Pro/15 Pro Max motherboard.

Optional Type:

Option 1: HT007 Heating Soldering Station Standard
Option 2: HT007 Heating Host
Option 3: For iPhone X-11 pro max Pre-Heating groove
Option 4: For iPhone 12-12 pro max Pre-Heating groove
Option 5: For iPhone 13/13Pro Max Mold
Option 6: For iPhone 13Mini/ 13Pro Mold
Option 7: For iPhone 13Mini/ 13Pro Mold
Option 8: For iPhone 14/14Pro/14Pro Max Mold
Option 9: For iPhone 15/15Plus/15 Pro/15 Pro Max mold.

      Features : 

      1. Support voltage 110V-220V.
      2. Output safe voltage 24V DC high performance intelligent welding station.
      3. The dynamic temperature is displayed in real time by a microcomputer and the eddy current heating system makes the power smaller and the heating efficiency higher.
      4. The resistance heating + electromagnetic induction heating at the same time makes the eddy current heating more powerful.
      5. The optimum precise welding temperature can be calculated in real time by synchronous ambient temperature, which makes the welding work more ideal and convenient.

      Advantage:

      1. Bandung universal welding platform, supporting the use of soldering iron, supporting the expansion of iPhone X-15 Pro Max Layered motherboard, tin planting, bonding.
      2. Heating the central column only! Protect motherboard IC from damage!
      3. Supporting computer control, timely warning of tin melting, customizable time, and soldering iron
      4. Hibernation function, one-click memory temperature function and so on!


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