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Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888

Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888
New
Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888
  • Stock: In Stock
  • Model: SM8350
  • Weight: 0.02kg
People Interested: 1025
Rs.249
Ex Tax: Rs.249
Wholesale Price
QtyDiscount
5 -20.08%
Amaoe 0.12mm Wafer Positioning BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888

Package includes:
  • 1 x Stencil

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Tags: Amaoe , Flux , Paste , STENCIL , 2uul , PPD , JC