Brand: MIJING
Model: Iph-7
MIJING BGA Stencil is a High Precision BGA Rebelling TemplateCompatible with iPhone 7, 7 PlusCan be used with direct heat.This is a required tool for rebelling ice's.This product is small and strong...
Rs.249
Ex Tax:Rs.249
Brand: AMAOE
Model: HI1
amao-hi1-bga-reballing-stencil-for-huawei-hi6421-hi6523-hi6551-6555-6521m-hi6561-hi6422-6553-hi6921..
Rs.180
Ex Tax:Rs.180
Model: OnePlus 10 Pro
..
Rs.199
Ex Tax:Rs.199
New
Brand: AMAOE
Model: X-15 LCD IC 4in1
Amaoe 0.12mm 4-in-1 Screen LCD IC BGA Reballing Stencil for iPhone X to 15Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199
Brand: AMAOE
Model: IP-17
Amaoe 0.12mm Baseband/Hard Disk/WiFi/NFC/Chip Board Carrying BGA Reballing Stencil for iPhone 7 to 14Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199
New
Brand: AMAOE
Model: SM4450
Amaoe 0.12mm CPU BGA Reballing Stencil for Qualcomm SM4450 Snapdragon 4Gen2Package includes:1 x Stencil..
Rs.220
Ex Tax:Rs.220
New
Brand: AMAOE
Model: 1+11
Amaoe 0.12mm Middle Layer BGA Reballing Stencil for OnePlus 11Package includes:1 x Stencil..
Rs.250
Ex Tax:Rs.250
New
Brand: AMAOE
Model: SM-F711U
Amaoe 0.12mm Middle Layer BGA Reballing Stencil for Samsung Galaxy Z Flip3 5G SM-F711U / B / N / 0 / D / W..
Rs.199
Ex Tax:Rs.199
New
Brand: AMAOE
Model: MT6886V
Amaoe 0.12mm MTK Dimensity 7200-Ultra MT6886V BGA Reballing StencilPackage includes:1 x Stencil..
Rs.249
Ex Tax:Rs.249
New
Brand: AMAOE
Model: MSM8260
Amaoe 0.12mm Qualcomm Snapdragon MSM8260 CPU BGA Reballing StencilPackage includes:1 x Stencil..
Rs.249
Ex Tax:Rs.249