1.MJ high quality BGA Reballing Stencil, 100% new brand and high quality.2.Ultra-thin steel template, just 0.12mm thickness, easy to use.3.Precison sq..
1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding2. Good toughness3. High temperature resistance4. 0.12mm, m..
Flux Type: UV-559Volume: 10ml/10ccDimension: 93 x 33 x 23mmMaterial:the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid th..
MiJing Z20 10in1 BGA Reballing Stencil Net Fixture Holder for iPhone X / XR / Xs / Xs Max / 11 / 11 Pro / 12 / 12 mini / 12 Pro / 12 Pro MaxFeature:MJ..
Product DescriptionFeatures:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase main..
SM8250 SM8150 RAM BGA Stencil 855 Upper Layer IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole.Amaoe High Quality BGA Reballing Stencil for Qu..