Amaoe Mi11 0.12MM BGA Stencil IC Solder Reballing Tin Net for Xiaomi CC9 / CC9e / A3 / Redmi NOTE8 SM6125 / SDM710 CPU
Rs.180
Ex Tax:
Rs.180
Amaoe Mi11 0.12MM BGA Stencil IC Solder Reballing Tin Net for Xiaomi CC9 / CC9e / A3 / Redmi NOTE8 SM6125 / SDM710 CPU
We also recommend
Out Of Stock
0.04mm 1000m LCD Screen Separation Wire Cutting Line for iPhone lcd touchscreen glass separate gold molybdenum cutting wire line100% brand new，High te..
Rs.399
Ex Tax:Rs.399
-17 %
Features:RL-404S 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repairTin ..
Rs.249 Rs.300
Ex Tax:Rs.249
Out Of Stock
eMMC/eMCP Socket BGA221 / BGA254 Test Socket Adapter for UFI-Box. UFI Box is a powerful EMMC Service Tool that can Read EMMC user data,..
Rs.3,000
Ex Tax:Rs.3,000
From the same brand
10in1 Double-headed multi-function prying knife Set..
Rs.300
Ex Tax:Rs.300
amao-hi1-bga-reballing-stencil-for-huawei-hi6421-hi6523-hi6551-6555-6521m-hi6561-hi6422-6553-hi6921..
Rs.180
Ex Tax:Rs.180
New
Amaoe 0.12mm 4-in-1 Screen LCD IC BGA Reballing Stencil for iPhone X to 15Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199
Amaoe 0.12mm Baseband/Hard Disk/WiFi/NFC/Chip Board Carrying BGA Reballing Stencil for iPhone 7 to 14Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199