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Amaoe Middle Layer BGA Reballing Stencil for SAMSUNG S10 5G-G977U/R/T/P CPU IC Chip Tin Planting Soldering Net

Amaoe Middle Layer BGA Reballing Stencil for SAMSUNG S10 5G-G977U/R/T/P CPU IC Chip Tin Planting Soldering Net
Amaoe Middle Layer BGA Reballing Stencil for SAMSUNG S10 5G-G977U/R/T/P CPU IC Chip Tin Planting Soldering Net
  • Stock: In Stock
  • Model: G977U
  • Weight: 0.01kg
People Interested: 2070
Rs.199
Ex Tax: Rs.199

Amaoe Middle Layer BGA Reballing Stencil for SAMSUNG S10 5G-G977U/R/T/P CPU IC Chip Tin Planting Soldering Net

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Tags: HSTOOLSWORLD , MCN , MIJING , 2UUL , B&R , AMAOE