Amaoe U-HIS4 BGA Reballing Stencil For Huawei HI3690 Mate30 Mate30Pro MateX Mate20RS Nova6 P40 Honor V30 CPU RAM
Rs.180
Ex Tax:
Rs.180
Amaoe U-HIS4 BGA Reballing Stencil For Huawei HI3690 Mate30 Mate30Pro MateX Mate20RS Nova6 P40 Honor V30 CPU RAM
We also recommend
Out Of Stock
0.04mm 1000m LCD Screen Separation Wire Cutting Line for iPhone lcd touchscreen glass separate gold molybdenum cutting wire line100% brand new，High te..
Rs.399
Ex Tax:Rs.399
-17 %
Features:RL-404S 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repairTin ..
Rs.249 Rs.300
Ex Tax:Rs.249
Out Of Stock
eMMC/eMCP Socket BGA221 / BGA254 Test Socket Adapter for UFI-Box. UFI Box is a powerful EMMC Service Tool that can Read EMMC user data,..
Rs.3,000
Ex Tax:Rs.3,000
From the same brand
10in1 Double-headed multi-function prying knife Set..
Rs.300
Ex Tax:Rs.300
amao-hi1-bga-reballing-stencil-for-huawei-hi6421-hi6523-hi6551-6555-6521m-hi6561-hi6422-6553-hi6921..
Rs.180
Ex Tax:Rs.180
New
Amaoe 0.12mm 4-in-1 Screen LCD IC BGA Reballing Stencil for iPhone X to 15Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199
Amaoe 0.12mm Baseband/Hard Disk/WiFi/NFC/Chip Board Carrying BGA Reballing Stencil for iPhone 7 to 14Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199