Features: 1# blade: mainly used to disassemble the small chip or remove the glue of the small chip. 2# blade: mainly used to disassemble large chips or remove the glue of large chips. 3# blade: mainly used for the disassembly and glue removal of double-layer or single-layer CPU chips. 4# blade: specially designed for Android fonts, and can also be used to disassemble other chips. 5# blade: used for chip hooking and scraping glue, suitable for small gaps and corners. 6# blade: mainly used to disassemble the Nand flash, baseband, WIFI IC.
Blade handle: imported material, high temperature resistance, no heat conduction, anti-static, light and flexible, easy to use.
QIANLI 2D BUMBLEBEE STENCIL QS23 SAMSUNG EXYNOS CPU 2SUPPORTED CPUEXYNOS990 A - EXYNOS7885 A - EXYNOS9610A -EXYNOS 7420A - EXYNOS990 B -EXYNOS7885 B -..