RELIFE RL-403 BGA Solder Paste Flux Syringe 10CC 183℃ Sn63/Pb37 20-38um no-clean Lead Soldering Paste - 1

1.Good adhesion. Paste delicate, particles small, only 20~38 microns.

2.Excellent wettability.After opening, the surface remains moist for 36 hours. Does not affect the welding.

3.Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive