AiXun UP200 solder paste is designed with special lead free formula. It features no-clean, no corrosion, high permeability, good liquidity, limpid liquid, less smoke, no smell, good insulativity and high activity, limpid and transparent liquid, not easy to oxidize, which allow it easily handle with BGA reballing, rework, components soldering and desoldering, soldering repair and other mobile maintenance activities. This nano lead free solder paste is a necessary repair tool for soldering and desoldering works.
List of Packing:
1 x Lead free nano solder past
• Suitable for BGA ball planting, rework, component soldering, repair soldering, etc. of precision electronic devices
• Exclusive formula, no-cleaning, no corrosion, high permeability, excellent fluidity, transparent colorless liquid, strong welding ability
• Low smoke, odorless, lead-free, environmentally friendly
• Clear and transparent, strong fluidity, moderate viscosity
• Good insulation, high activity, not easy to oxidize
