Features:
1# blade: mainly used to disassemble the small chip or remove the glue of the small chip.
2# blade: mainly used to disassemble large chips or remove the glue of large chips.
3# blade: mainly used for the disassembly and glue removal of double-layer or single-layer CPU chips.
4# blade: specially designed for Android fonts, and can also be used to disassemble other chips.
5# blade: used for chip hooking and scraping glue, suitable for small gaps and corners.
6# blade: mainly used to disassemble the Nand flash, baseband, WIFI IC.

Blade handle: imported material, high temperature resistance, no heat conduction, anti-static, light and flexible, easy to use.