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KAISI 220°C HIGH-TEMPERATURE MELTING POINT LEAD-FREE SOLDER PASTE FOR MOBILE PHONE BGA REPAIR - 40G

KAISI 220°C HIGH-TEMPERATURE MELTING POINT LEAD-FREE SOLDER PASTE FOR MOBILE PHONE BGA REPAIR - 40G
-27 %
KAISI 220°C HIGH-TEMPERATURE MELTING POINT LEAD-FREE SOLDER PASTE FOR MOBILE PHONE BGA REPAIR - 40G
  • Stock: In Stock
  • Model: KAISI-220
  • Weight: 0.05kg
People Interested: 13041
Rs.329.00
Rs.449.00
Ex Tax: Rs.329.00
Kaisi 40g 220°C High-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Features:
Kaisi 40g 220°C High-temperature solder paste, a high-temperature lead-free solder paste customised for high-end motherboard repair
Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store
High Density/High Resistance Strong Activity/Strong Welding Force
Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution
Meet the maintenance needs of motherboards for Huawei and Apple high-end machines
Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
Good soldering and welding tool

Package includes:
1 x Solder Paste

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