MIJING

MIJING BGA Stencil is a High Precision BGA Rebelling TemplateCompatible with iPhone 7, 7 PlusCan be used with direct heat.This is a required tool for rebelling ice's.This product is small and strong...

High Temperature MiJing 138A 158A 217A 190A Lead-free Solder Tin Paste Medium and Welding Flux Soldering Paste Repair for Phone..

Conversion: ≈88%Steady current state CC: 0~The rated current is continuously adjustableSteady current state CV: 0~The rated voltage is continuously adjustablePackage includes :1 x Power Supply1 x Power Cable..

Mijing Aeolus X1 Rechargeable 3-in-1 UV Curing / Smoke Exhaust / Cooling Fan for PCB RepairFeatures:Three-in-one: Cooling, smoke exhausta, UV curingThree-gear wind speed adjustment, extremely fast cooling in three secondsHigh power UV curing lamp, fulcrum power, unbounded creativityPackage includes..

MiJing AP-11 Earphone Repair Fixture for AirPods 1-3/AirPods Pro 1/Pro 2ma..

Mijing AR-2015 / AR-2020 Alpha Tin-Absorbing Wire for Motherboard IC Chip Cleaning - 5PcsFeatures:Fluorine-free with less residue, good desoldering, and cleaning effectStrong absorption, and fast tinning, greatly reduce damage to circuit boardsSmall and portable, anti-oxidation, soft weaving de..

Mijing AR-2015 Alpha Tin-Absorbing  Desoldering Wick / Wire for Motherboard IC Chip Cleaning - 1PcsFeatures:High-purity copper wire braiding can quickly absorb molten solder and improve maintenance efficiencyOxidation-resistant coating, no residue design, up 80% adsorbing powerStrong flexibilit..

Mijing AR-2020 Alpha Tin-Absorbing  Desoldering Wick / Wire for Motherboard IC Chip Cleaning - 1PcsFeatures:High-purity copper wire braiding can quickly absorb molten solder and improve maintenance efficiencyOxidation-resistant coating, no residue design, up 80% adsorbing powerStrong flexibilit..

Gross weight600gBrandsMiJing..

Product DescriptionFeatures:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speed Check in advance to avoid duplicate disassembling and breaking the motherboard Small size, easy to carry.Operational Process: 1..

Feature:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speedCheck in advance to avoid duplicate disass..

Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speedCheck in advance to avoid duplicate disassembling&..