MIJING BGA Stencil is a High Precision BGA Rebelling TemplateCompatible with iPhone 7, 7 PlusCan be used with direct heat.This is a required tool for rebelling ice's.This product is small and strong...
Conversion: ≈88%Steady current state CC: 0~The rated current is continuously adjustableSteady current state CV: 0~The rated voltage is continuously adjustablePackage includes :1 x Power Supply1 x Power Cable..
MIJING SOLDER PASTE TOOL FOR PCB SMD BGADescriptionHigh quality solder paste Tack lasting, easy to dry Adapted to the mobile phone repair industry, computer digital service industriesHigh-precision circuit board soldering SMT, BGA, PCB soldering processes, etc.Specifications:Model: M..
MIJING SOLDER PASTE TOOL FOR PCB SMD BGADescriptionHigh quality solder paste Tack lasting, easy to dry Adapted to the mobile phone repair industry, computer digital service industriesHigh-precision circuit board soldering SMT, BGA, PCB soldering processes, etc.Specifications:Model: M..
Mijing AR-2015 / AR-2020 Alpha Tin-Absorbing Wire for Motherboard IC Chip Cleaning - 5PcsFeatures:Fluorine-free with less residue, good desoldering, and cleaning effectStrong absorption, and fast tinning, greatly reduce damage to circuit boardsSmall and portable, anti-oxidation, soft weaving de..
Product DescriptionFeatures:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speed
Check in advance to avoid duplicate disassembling and breaking the motherboard
Small size, easy to carry.Operational Process:
1..
Feature:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speedCheck in advance to avoid duplicate disass..
Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speedCheck in advance to avoid duplicate disassembling&..
Feature:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speedCheck in advance to avoid duplicate disassembling and breaking the motherboardSmall size, easy to carry.Operational Process: 1, Prepare: Power On/O..
Feature:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speedCheck in advance to avoid duplicate disass..