Amaoe High-Precision Universal BGA Reballing Stencil (0.12mm Thickness)
Take your micro-soldering accuracy to the master level with the Amaoe Universal BGA Reballing Stencil. Specifically engineered for component-level repair technicians, this multi-functional "tin planting net" provides an all-in-one matrix grid solution. It layout covers four of the most critical pitch sizes used in modern smartphone hardware: 0.3mm, 0.35mm, 0.4mm, and 0.5mm.
Whether you are rebuilding a stubborn power management IC (PMIC), audio codec, charging chip, or micro-controller across Android or iPhone motherboards, this stencil guarantees consistent, uniform solder ball formation under direct heat profiles.
Key Technical Features:
- Precision-Cut Square Holes: Unlike generic stencils with stamped round mesh holes, Amaoe uses premium laser-cut square holes. This distinct geometry prevents solder paste from sticking or tearing inside the matrix, ensuring a clean, crisp release every single time you lift the plate.
- Warp-Resistant 0.12mm Thickness: Optimized at a precise 0.12mm thickness to deliver the perfect solder ball volume. Crafted from high-grade, heat-stabilized stainless steel, it resists expanding or bowing upward when subjected to 330°C–350°C hot air station currents.
- Anti-Bridging Hole Alignment: Features specialized parallel and 45-degree misaligned matrix patterns. This advanced design prevents liquid solder from jumping across micro-gaps, significantly reducing the risk of bridges on high-density IC landings.
- Universal Multi-Chip Layout: Eliminates the clutter of hunting down specific dedicated plates. One sheet provides the exact pitch parameters required to reball hundreds of peripheral ICs from Qualcomm, MediaTek, Exynos, and Apple chipsets.
Product Specifications:
Feature | Details |
Brand / Model | Genuine Amaoe Universal Series |
Supported Pitch Sizes | 0.3mm / 0.35mm / 0.4mm / 0.5mm Matrix Configurations |
Sheet Thickness | 0.12mm |
Hole Design | Laser Square Mesh with 45° Misaligned Zones |
Material | Premium Anti-Deformation Stainless Steel Alloy |
Primary Use | Smartphone CPU, PMIC, EMMC, UFS, and Audio IC Repair |
Why Micro-Soldering Labs Buy Amaoe from HS Tools World
- No Solder Ball Waste: The precision hole walls make sure your solder paste rolls smoothly into clean spheres without forming irregular chunks or flakes.
- Direct Heat Capability: Built to take direct hot air gun profiles without requiring heavy magnetic clamping frames or excessive weighting tools.
- Genuine Quality Assurance: At HS Tools World, we distribute 100% original Amaoe products. Say goodbye to soft clone stencils that warp out of shape after just two repair jobs.
- Seamless Ordering for Labs: Stock up your micro-repair bench with easy Cash on Delivery (COD) payment options and express shipping across India.
Master Bench Pro-Tip: To get the longest life out of your Amaoe stencil, avoid scraping paste with aggressive metal blades; use a flexible silicone scraper instead. Always clean leftover residue immediately using high-purity Isopropyl Alcohol (IPA) and a lint-free ESD safe brush before storing the mesh flat.
