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FONEKONG 183℃ MELTING POINT SPECIAL SOLDER PASTE FOR BGA REBALLING - 42G

FONEKONG 183℃ MELTING POINT SPECIAL SOLDER PASTE FOR BGA REBALLING - 42G
-50 %
FONEKONG 183℃ MELTING POINT SPECIAL SOLDER PASTE FOR BGA REBALLING - 42G
  • Stock: In Stock
  • Model: FK-183
  • Weight: 0.10g
People Interested: 27665
Rs.249.00
Rs.499.00
Ex Tax: Rs.249.00

FONEKONG 183°C Melting Point Special Solder Paste for BGA Reballing – 42G


The FONEKONG 183°C Melting Point Special Solder Paste (42G) is a premium-quality soldering consumable designed for BGA reballing, IC soldering, PCB repair, SMT assembly and chip-level motherboard repair. Formulated with a 183°C melting point, it provides excellent solderability, smooth flow and strong solder joints, making it ideal for professional electronics repair and precision soldering applications.


This high-performance solder paste offers superior wetting characteristics, minimal residue and reliable conductivity, ensuring stable and durable solder connections. It is widely used by technicians for repairing mobile phones, laptops, tablets, gaming consoles and other electronic devices requiring precision BGA and SMT soldering.


Key Features

  • Premium FONEKONG quality solder paste
  • 183°C melting point for stable and efficient soldering
  • Net Weight: 42G
  • Excellent wetting performance for smooth solder flow
  • Strong and reliable solder joints
  • Low residue formula for cleaner PCB repairs
  • High oxidation resistance for extended usability
  • Ideal for precision BGA reballing and IC replacement
  • Suitable for professional chip-level electronics repair


Applications

  • BGA Reballing
  • IC Chip Soldering & Replacement
  • PCB Repair & Maintenance
  • SMT Component Assembly
  • Mobile Phone Motherboard Repair
  • Laptop & MacBook Logic Board Repair
  • Tablet & Gaming Console Repair
  • Consumer Electronics Manufacturing
  • Electronics Service Centers


Benefits

  • Produces clean, smooth and durable solder joints
  • Improves soldering efficiency and repair quality
  • Reduces solder bridging and cold solder joints
  • Ensures excellent electrical conductivity
  • Suitable for fine-pitch BGA and SMD components
  • Trusted by professional repair technicians


Specifications

  • Brand: FONEKONG
  • Product Type: Special Solder Paste
  • Melting Point: 183°C
  • Net Weight: 42G
  • Application: BGA Reballing, IC Soldering, SMT Assembly, PCB Repair


Package Includes

  • 1 × FONEKONG 183°C Melting Point Special Solder Paste – 42G

Note: Store the solder paste in a cool environment and keep the container tightly sealed after use. Stir gently before application if recommended by the manufacturer for the best soldering performance.


Why Buy from HSToolsWorld?

  • ✅ 100% Genuine FONEKONG Product
  • ✅ Best Price in India
  • ✅ Cash on Delivery (COD) Available
  • ✅ Bajaj Finance EMI Available
  • ✅ Fast & Secure Shipping Across India
  • Trusted Supplier of Professional Mobile & Laptop Repair Tools

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