Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering

Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering

Features:

• New heat-resistant silica pads say goodbye to messy desktops, a large working area, multi-section for organizing, no deformation under high heat
• High heat resistance up to 500℃, no deformation under high heat, protects the desk from heating, its heat resistance can function very well under up to 500℃ circumstances, no matter if a heat gun, iron, solder station, or other tools and equipment cause it
• Strong toughness, no deformation, curls freely, twists without deformation, good resilience, and convenient storage
• Effective waterproof and easy to maintain, stain resistant, easy to clean, keep the desktop tidy

Package includes:

• 1 x Silicone Pad