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Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering

Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering
New -9 %
Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering
  • Stock: In Stock
  • Model: FW-S500
  • Weight: 0.80kg
People Interested: 7
Rs.999.00
Rs.1,100.00
Ex Tax: Rs.999.00

Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering

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