Feature:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speedCheck in advance to avoid duplicate disassembling and breaking the motherboardSmall size, easy to carry.Operational Process: 1, Prepare: Power On/O..
Feature:Easy to use, connect the upper and lower motherboards for testing/repair, avoid problems after installation, increase maintenance speedCheck in advance to avoid duplicate disass..
MIJING CH5-D INTELLIGENT MAINBOARD LAYERED WELDING PLATFORM FOR IPHONE 12/12 PROPS: this new version CH5-D main unit can not used on the old CH5 main unit.Three-in-one universal iPhone 12/12P, support A14 CPU chip, A14 HHD, iPhone 12/12P Baseband, iPhone 12/12P baseband and glue removal.Precise posi..
1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding2. Good toughness3. High temperature resistance4. 0.12mm, make phone repairs easier, make rebelling work easier.5. Heated anti-drum design..
Item specificsCondition:New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is applicable). Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, su..