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MECHANIC ix5 Max Motherboard Layering Chip CPU Remove Preheating Platform for iPhone 11 Pro Max / 11 Pro / 11 / XS Max / XS / X, CN Plug

MECHANIC ix5 Max Motherboard Layering Chip CPU Remove Preheating Platform for iPhone 11 Pro Max / 11 Pro / 11 / XS Max / XS / X, CN Plug
In Stock
MECHANIC ix5 Max Motherboard Layering Chip CPU Remove Preheating Platform for iPhone 11 Pro Max / 11 Pro / 11 / XS Max / XS / X, CN Plug
  • Stock: In Stock
  • Model: IX5 Max
  • Weight: 1.80kg
People Interested: 2929
Rs.3,000
Ex Tax: Rs.3,000

1. For iPhone 11 Pro Max / 11 Pro / 11 / XS Max / XS / X
2. Heating Layering
3. Safety and Efficiency Laying
4. Crack-Proof Tin
5. No need the hot air rework station
6. One button for power ON/OFF, easy use
7. Mini size, can put under microscope for use, easy to observe

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