Mobile Repair Equipment

QUICK 861DW 1000W BGA Rework Station Hot Air Gun Intelligent Lead-Free Desoldering Station For SMD/SOIC/CHIP/PLCC/BAG RepairSpecial Features1. Has CH1, CH2, CH3 three working channels , and each channel can be set to the amount of wind , and temperature.2. With password protection and key lock funct..

Easily chanel the heat from your Quick 861DW at a nice 45 Degrees angle with this set of   nozzles by Quick.Ideal for working under a microscope.Great for side heating too.Solve the problem of CPU side horizontal heating that cannot be solved by ordinary nozzle.Customized microscope curved..

Quick 881D Rework Station 1300W Quick 861DW Flagship Edition+Quick 856AD Hardcover Edition Hot Air BGA Soldering Rework Station1300W Quick 881D BGA Rework Station, professional Mobile Phone circuit board BGA desoldering Tool, 2-IN-1 Upgrade version from Quick 856AD Hardcover Edition + Quick 861DW Fl..

DATA SHEETHeight100mmWidth40mmWeight200GMORE INFOOriginal QUICK236 soldering iron soldering iron handle heating element 907DQUICKMade in ChinaModel: Quick-907DQUICK236 special handle for welding station..

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Rabbit FixAndroid Charging Check, Small BoardRabbit Fix Android TYPE-CTail Detection Test Small Board,Charging DNDP DetectionQuick Detection Of Fast Charging Tools..

10CC RL-421-OR Strong activity BGA Flux Paste for PCB, SMD, BGA Reballing Soldering, Relife RL-421-OR Soldering Paste Flux can be used for soldering and reballing of computer and phone chips. It is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residu..

20ml Relife RL-429 Phone BGA Solder Hose Flux Paste Imported Raw Material for Better Soldering Maintenance..

RELIFE RL-428-OR is a highly active halogen-free viscous soldering paste. Due to its high insulation resistance, it can be used for PCB soldering and reballing.FeaturesLight yellow soldering paste without impurities.Features high viscosity and strong activity.Easy to apply.Due to its high insul..

RELIFE RL-223-OR is a lead free high quality solder paste designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.FeaturesLead free and no residue.Features high viscosity and high activity.Provides quick and high-quality tinning with a minimum amount of smoke.Techni..