Relife HW11 Lead Free And Halogen Free Solder Flux For Mobile Phone Repair

Relife HW11 Lead Free And Halogen Free Solder Flux For Mobile Phone Repair

Key Features and Specifications

• Composition: It is a lead-free and halogen-free formula, adhering to modern environmental standards and ensuring a safer work environment with minimal smoke and odor.
• Application: Ideal for intricate tasks such as:
• CPU and chip desoldering and repair.
• BGA (Ball Grid Array) tinning/soldering.
• Precision welding of various electronic components.
• Mobile phone motherboard repair.
• Performance:
• Activity: It has a nano high-activity factor, which quickly removes the oxide film from surfaces, ensuring a strong, reliable bond and preventing cold soldering.
• Fluidity: The paste is described as having good fluidity and high tackiness, allowing for accurate application on fine-pitch components and precise stencil printing without slumping or bleeding.
• Residue: It is a "no-clean" formula, leaving minimal, non-conductive residue after soldering, which reduces post-cleaning time and the risk of short circuits.
• Joint Quality: It promotes the formation of bright, full, and uniform solder joints.
• Packaging: It typically comes in a syringe with extra application tips for accurate dispensing, reducing waste and allowing for one-handed operation.
• Storage: The recommended storage temperature for optimal shelf life is typically 0–10°C (refrigerated).