RMA-218 New Kingbo 100G Bga Soldering Flux Solder Paste

Details The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, , sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates. It is original made in Japan. Good formula for BGA Reballing / balls work sit can stick the balls much more. , Package Included: 1Pcs 100gram