2UUL BG01 4-in-1 ABCD BGA Reballing Stencil Set for iPhone 8 to 16Pro Max 0.12MM (Without 16E)

2UUL BG01 4-in-1 ABCD BGA Reballing Stencil Set 0.12mm is a precision reballing stencil kit designed for professional iPhone motherboard and BGA repair. This set supports repair work on compatible iPhone 8 through iPhone 16 Pro Max models.

With a 0.12mm stencil thickness and 4-in-1 ABCD design, it is suitable for precise solder ball alignment and efficient BGA reballing during CPU and motherboard repair.

Key Features

• Brand: 2UUL
• Model: BG01
• Type: 4-in-1 ABCD BGA Reballing Stencil Set
• Thickness: 0.12mm
• Compatibility: iPhone 8 to iPhone 16 Pro Max
• Exclusion: iPhone 16E is not included
• Designed for professional BGA reballing and motherboard repair
• Suitable for mobile phone repair technicians

Applications

Ideal for iPhone CPU BGA reballing, IC repair, motherboard repair, and solder ball alignment on compatible models.

Why Buy from HSToolsWorld?

• Professional mobile motherboard repair tools
• Cash on Delivery Available
• Bajaj Finance Available on eligible orders
• Fast shipping across India

Note: Please confirm the required iPhone model and stencil compatibility before ordering.