FONEKONG 148°C Low-Temperature Solder Paste – 42g is designed for professional BGA reballing, PCB repair, and mobile phone motherboard servicing. Its specified 148°C melting point makes it suitable for compatible low-temperature soldering and rework applications.
This solder paste is useful for technicians performing precision IC repair and BGA reballing on mobile phone and electronic circuit boards.
Key Features
- Brand: FONEKONG
- Product Type: Low-Temperature Solder Paste
- Melting Point: 148°C
- Quantity: 42g
- Designed for BGA reballing applications
- Suitable for compatible PCB and motherboard repair work
- Ideal for professional mobile repair technicians
Applications
Suitable for BGA reballing, IC repair, PCB soldering, mobile motherboard repair, and precision electronics rework, depending on the component and manufacturer's recommended process.
Why Buy from HSToolsWorld?
- Professional mobile repair tools and consumables
- Cash on Delivery available
- Bajaj Finance available on eligible orders
- Shipping across India
Note: Confirm that the 148°C melting point is suitable for your component and soldering process. Follow the manufacturer's heating profile and usage instructions.
