2UUL BH04 Micro Jig IC Mini Glass Fixture for Mobile Phone Motherboard Repair

2UUL BH04 MICRO JIG IC Mini Glass Fixture for Mobile Phone Motherboard Repair

Key Features and Specifications

• Material: Features a tempered, insulated glass work surface that is highly resistant to heat (up to 500°C) and easy to clean of welding oil and rosin.
• Secure Clamping: Employs a rotary fixed design and a unique force-bearing IC beam clamp to hold motherboards and chips firmly without movement or rebound during intense work, preventing damage to the IC.
• Adjustability: The fixture is adjustable to high, middle, and low levels by loosening bottom screws, accommodating PCBs and chips of various sizes and thicknesses.
• Heat Dissipation: Designed with a heat sink at the bottom and anti-skid pads that allow hot air to discharge more efficiently, protecting the components.
• Multi-Functionality: Ideal for a wide range of micro-soldering tasks, including:
• General mobile phone motherboard repair.
• Fixing large chips like CPU and NAND for cleaning and tin removal.
• Protecting double-layer motherboards during separation and reassembly.
  
  Package includes:
• 1 x Fixture
• 
  

•