The Amaoe SAM12 0.12mm BGA Reballing Stencil is an ultra-premium, workshop-grade thermal matrix engineered specifically for high-level CPU transplants, RAM sandwich separations, and chip re-soldering on flagship smartphones. This professional stencil is precisely cut to fit the Qualcomm Snapdragon 865 (SM8250) and the Samsung Exynos 990 chipsets, which run the entire Samsung Galaxy S20 Series (including the S20, S20+, and S20 Ultra).
When flagship devices suffer from sudden death, permanent boot-loops, or frozen screens due to dropped solder joints under the processor, the Amaoe SAM12 provides the micrometric accuracy required to cleanly detach, re-ball, and re-seat the main CPU without creating devastating solder bridges.
Key Structural Features & Bench Advantages:
- Signature 0.12mm Square-Hole Matrix: Features proprietary laser-cut square holes that allow solder paste to form uniform, spherical micro-balls. The square shape prevents the paste from clinging to the walls, ensuring a clean release when lifting the plate.
- Premium Anti-Deformation Steel Alloy: Manufactured from imported, high-grade heat-resistant steel. The plate maintains its flat profile under high thermal stress, preventing the edges from warping or bowing upward under your hot air gun.
- High-Precision Laser Alignment: The grid pattern perfectly aligns with the dense contact pad layout of the Snapdragon 865 and Exynos 990, eliminating manual adjustment errors and reducing re-work time under the microscope.
- Optimized Thermal Dissipation Vents: Engineered with specialized micro-slots surrounding the chip area to balance airflow pressure, safely channeling away excess heat to eliminate thermal blistering on adjacent layers.
Technical Specification Matrix
Parameter Profile | Component Specification Details |
Brand / Model | Amaoe Original (SAM12 Edition) |
Stencil Matrix Thickness | 0.12mm Ultra-Thin Precision Profile |
Hole Geometry | Advanced Laser-Cut Square Holes |
Supported Chipsets | Qualcomm Snapdragon 865 (SM8250) & Samsung Exynos 990 |
Compatible Smartphone Range | Samsung Galaxy S20, S20 Plus, S20 Ultra, S20 FE |
Material Base | High-Tensile, Heat-Resistant Stainless Steel Alloy |
Primary Bench Utility | CPU/RAM Sandwich Reballing, IC Reflow, Motherboard Boot-Loop Repairs |
Recommended Bench Operation Guide:
- IC Cleanup Prep: Desolder the CPU/RAM chip from the motherboard using your hot air station. Clean off the old factory underfill and residual lead-free solder from the chip pads using a premium desoldering wick and flux until the surface is completely flat. Clean thoroughly with pure isopropyl alcohol (IPA).
- Stencil Clamping & Alignment: Position the chip underneath the Amaoe SAM12 stencil. Align the micro-pads precisely under your microscope until every hole matches perfectly. Secure the chip firmly in place using a magnetic reballing fixture or high-temperature polyimide tape.
- Solder Paste Application: Using a flexible spatula, scrape a small amount of medium-temperature solder paste (183°C leaded paste is highly recommended for stable bench re-work) across the stencil holes. Wipe away all excess paste so that it only rests inside the square cavities.
- Reflow Profile: Set your hot air gun to approximately 280°C to 300°C with low airflow (to prevent blowing the stencil out of alignment). Hold the air nozzle vertically at a distance and apply circular heat. Watch under the microscope as the paste liquefies and forms perfect micro-spheres. Let it cool for 5 seconds before gently popping the re-balled chip out.
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