Relife RL-428-OR Solder Paste Flux Lead-free Welding Paste (100Gram)

The Relife RL-428-OR Lead-Free Solder Paste Flux (100g) is an advanced, high-activity rework flux formulated specifically for micro-soldering, smartphone motherboard rework, CPU/NAND BGA reballing, and SMD component repairs. Engineered with high-purity imported Japanese hydrogenated rosin, RL-428-OR features a clean, light-yellow transparent consistency free of impurities, ensuring uniform heat transfer, rapid wetting, and superior oxide breakdown across fine-pitch circuit pads.

With high surface insulation resistance and a completely halogen-free chemical formula, this flux prevents corrosion on sensitive copper micro-traces and eliminates high-impedance electrical leakage across dense ball grid arrays. Its balanced viscosity holds tiny 01005 passives and BGA chips securely in place during hot-air alignment, yet reflows smoothly without aggressive boiling or excessive smoke.

Key Capabilities & Engineering Features

• Imported High-Purity Japanese Rosin: Clean, light-yellow formulation delivers rapid deoxidation on copper, gold, and tin-plated pads without carbonizing under sustained hot-air rework.
• Halogen-Free & Environmentally Safe: Formulated with non-corrosive organic activators that comply with international environmental standards, safeguarding delicate mobile logic boards against chemical degradation.
• High Insulation Resistance: Extremely high dielectric strength prevents stray capacitance, leakage currents, and micro-shorts on dense smartphone logic boards and baseband power circuits.
• Controlled Viscosity & Strong Adhesion: High-tack consistency keeps micro-components, jumper wires, and BGA ICs firmly seated on solder pads, preventing component shifting during initial hot-air heating.
• Minimal, Transparent Residue: Reflows into a clear, non-conductive residue that will not harden or crust. Easily dissolved and washed away using PCB cleaner or 99% isopropyl alcohol (IPA).
• Smooth Thermal Transfer: Promotes consistent thermal distribution across multi-layer PCBs, ensuring even alloy flow, mirror-bright solder joints, and zero cold solder joints.
• Workshop-Ready 100g Tub: Generous 100-gram container with an airtight screw cap and protective inner seal, maintaining fresh flux moisture and preventing bench drying.

Technical Specification Matrix

Recommended Bench Workflows

1. BGA Chip Desoldering & Pad Pre-Wetting

1. Apply a small bead of RL-428-OR around the perimeter of the targeted IC (e.g., Audio IC, PMIC, Baseband).
2. Heat the chip evenly using hot air. The flux will wick beneath the package, breaking down oxidized solder joints and allowing smooth chip removal without lifting delicate PCB pads.
3. Apply a thin layer across the desoldered board site and use a copper desoldering braid to wick excess solder flat and clean.

2. BGA Reballing & Alignment Reflow

1. Coat the cleaned chip pads with a microscopic layer of RL-428-OR before placing the reballed IC on the logic board.
2. The natural tackiness of the flux holds the IC in perfect alignment with the board pads.
3. Heat gently until reflow occurs; the high wetting action guides the IC into self-alignment through surface tension.

Package Contents:

• 1 × Relife RL-428-OR Lead-Free Solder Paste Flux (100g )