AMAOE 0.20MM BGA REBALLING STENCIL FOR NOTEBOOK SLJ8E
Rs.399.00
Ex Tax:
Rs.399.00
AMAOE 0.20MM BGA Reballing Stencil for Notebook SLJ8E
The AMAOE 0.20MM BGA Reballing Stencil for Notebook SLJ8E is a precision stencil designed for professional BGA chip reballing, IC repair, and notebook motherboard maintenance. Its accurate hole positioning helps technicians achieve consistent solder ball placement during chip reballing and refurbishment.
Made for precision repair work, this 0.20MM BGA stencil is suitable for technicians working on notebook motherboards and other compatible BGA packages. It helps simplify the reballing process and provides better alignment for reliable solder ball placement.
Key Features
- Brand: AMAOE
- Model: SLJ8E
- Stencil Thickness: 0.20MM
- Designed for BGA reballing
- Suitable for notebook motherboard repair
- Precise solder ball hole alignment
- Ideal for IC and chip rework
- Helps achieve consistent reballing results
- Suitable for professional repair technicians
- Compact and easy to handle
Applications
- Notebook motherboard repair
- BGA chip reballing
- IC chip refurbishment
- CPU and chipset reballing
- PCB repair and maintenance
- Electronics repair workshops
- Professional BGA rework applications
Package Includes
- 1 × AMAOE 0.20MM BGA Reballing Stencil SLJ8E
Why Buy from HSToolsWorld?
- Genuine professional repair tools
- Quality BGA and motherboard repair equipment
- Fast & secure shipping across India
- Cash on Delivery (COD) available
- Bajaj Finance EMI available
- Reliable customer support
