The 20mm Conductive Adhesive Copper Foil Tape is an essential workshop consumable engineered for mobile device logic board rework, EMI/RFI interference suppression, thermal dissipation, and ground trace reconstruction. Fabricated from pure high-purity electrolytic copper foil backed by an electrically conductive acrylic adhesive, this tape allows electrical current to pass seamlessly through both the copper sheet and the adhesive layer, creating reliable, solder-ready continuity without requiring mechanical fasteners.
The 20mm width offers the optimal surface area for lining RF shielding cans, wrapping internal flex cables, constructing wide ground planes, and heat-sinking high-power components such as CPUs, charging ICs, and baseband modules. The foil is fully solderable, allowing technicians to tack jumper wires, ground braids, or shielding tabs directly to the tape surface during intricate board restorations.
Key Capabilities & Engineering Features
- Dual-Plane Electrical Conductivity: Conductive particles embedded in the adhesive layer ensure low-resistance point-to-point electrical contact directly through the adhesive bond line.
- Effective EMI & RFI Shielding: Isolates sensitive RF stages, baseband processors, Wi-Fi/Bluetooth circuits, and display data lines against high-frequency electromagnetic noise and crosstalk.
- Directly Solderable Surface: High-purity copper accepts standard leaded and lead-free solder alloys cleanly, enabling quick solder anchoring for jumper grounds and bypass tracks.
- Thermal Heat Spreading: High thermal conductivity rapidly conducts localized heat away from hot-running power ICs and displays, diffusing thermal hotspots across internal chassis frames.
- Optimal 20mm Width: Delivers generous coverage for smartphone chassis cavities, tablet shielding frames, laptop motherboards, and battery bay isolation.
- Conformable & Tear-Resistant: Flexible foil contours smoothly around tight motherboard corners, stepped shields, and uneven internal housings without creasing or tearing.
- High-Tack Temperature-Resistant Adhesive: Bonds securely to metals, FR4 boards, glass, and plastics, maintaining grip under internal operational heat without lifting or leaving gummy residue.
Technical Specification Matrix
Parameter Profile | Specification Details |
Material Composition | 99.95% High-Purity Electrolytic Copper Foil |
Tape Width | 20 mm |
Foil Thickness | ~0.03 mm – 0.05 mm (Conformable profile) |
Adhesive Chemistry | Electrically Conductive Acrylic Pressure-Sensitive Adhesive (PSA) |
Conductivity Mode | Conductive through face and adhesive layer |
Operating Temperature | -10°C to +120°C (Solderable surface withstands brief rework iron heat) |
Shielding Effectiveness | >80 dB attenuation across 10 MHz – 1.5 GHz frequencies |
Primary Applications | Smartphone RF shielding, PCB ground bridging, heat sinking, flex cable wrapping |
Common Workshop Repair Applications
- Restoring Logic Board Shield Cans: Replaces cut or removed RF shield lids after BGA rework, restoring cellular reception and preventing Wi-Fi interference.
- Grounding Jumper Wire Anchors: Provides a wide, solderable ground pad across damaged PCB ground layers to ground micro-jumpers.
- Display & Digitizer Ghost-Touch Prevention: Shields display FPC cables from backlight inverter noise and capacitive coupling that cause touch jitter.
- Thermal Dissipation Paths: Forms thermal transfer bridges between hot PMIC/charging chips and internal metal chassis mid-frames.
Package Contents:
- 1 × Roll of 20mm Conductive Adhesive Copper Foil Tape
