- Stock: In Stock
- Model: CP3200B1G0
- Weight: 0.03kg
No warranty, no guarantee, and no replacement. Purchase only after proper verification and inspection.
The CP3200B1G0 Charging IC is an OEM-grade replacement power management component engineered specifically for the entire iPhone 16 lineup (iPhone 16, 16 Plus, 16 Pro, and 16 Pro Max). As a core controller within the USB Type-C power delivery and battery charging rail, this BGA chip regulates bus voltage, power handshake communication, and current flow from fast chargers into the main power management subsystem.
When an iPhone 16 series device suffers an over-voltage spike, water damage around the charging port, or damage from non-certified car chargers, the CP3200B1G0 is frequently compromised. Replacing this chip resolves critical power distribution failures, restoring genuine fast charging protocols and stable system wake-up.
Failure Symptoms Fixed by CP3200B1G0 Replacement
- Zero Current Draw (0.00A): Device shows no charging indicator when plugged into a USB-C power meter or tester.
- Fake / False Charging: The battery lightning bolt icon appears on display, but the percentage never increases or discharges while plugged in.
- Slow / Throttled Charging: Device fails to negotiate USB-PD fast charging protocols, remaining locked at basic 5V/0.5A or 5V/1.0A charging rates.
- VBUS / Motherboard Short Circuits: High-current short circuit to ground on the main charging rail, preventing device power-up or causing excessive thermal heating around the power stage.
- Intermittent USB-C Detection: Device fails to recognize accessories, charging cables, or computer data syncing.
Technical Specification Matrix
Parameter Profile | Specification Details |
Component Part Number | CP3200B1G0 |
Component Type | USB-C Power Delivery & Charging Management IC |
Package Style | Fine-Pitch Ball Grid Array (BGA) |
Quality Grade | OEM Original Quality / Factory New |
Contact Metallurgy | Lead-free solder ball matrix / Gold-pad underlay |
Compatibility | Apple iPhone 16, iPhone 16 Plus, iPhone 16 Pro, iPhone 16 Pro Max |
Recommended Stencil | Dedicated iPhone 16 Series Direct-Heat / Magnetic BGA Stencil |
Installation Requirement | Micro-soldering equipment, hot-air rework station, precision flux |
Professional Rework & Installation Guidelines
- Motherboard Separation (Pro/Max models): Use a regulated pre-heating platform to safely delaminate the double-decker logic board sandwich without flexing the interposer frame.
- Component Removal: Apply high-grade rework flux (such as Relife RL-428-OR) around the perimeter of the defective IC. Using a micro-nozzle with controlled hot air (~330°C–350°C, low airflow), heat evenly until the solder reflows, then lift the IC with micro-tweezers.
- Pad Bed Preparation: Clean residual old alloy completely with lead-free desoldering braid and PCB cleaner. Inspect pads under a microscope for lifted or torn traces before installation.
- Alignment & Soldering: Align the new CP3200B1G0 strictly to its pin-1 orientation marker. Apply a microscopic layer of tacky flux and heat perpendicularly until surface tension pulls the chip into self-alignment.
- Post-Repair Bench Diagnostics: Clean flux residue thoroughly with 99% IPA. Before complete housing reassembly, test the board on a DC power supply and USB-C tester to verify proper boot current draw and 9V/15V PD fast charge negotiation.
Package Contents:
- 1 × CP3200B1G0 USB Charging IC Chip for iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max
