FLUX PASTE / SOLDER PASTE

RELIFE RL-404S 138*C Solder Paste For BGA Repair (PPD Paste)Features:RL-404S 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repairTin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to StoreLow Melting Poi..

2UUL SC99 Nano Solder Paste Exclusive Use for Dock & FPC ConnectorKey Features & PerformanceNano-Grade Particles: Formulated with ultra-fine solder particles that ensure smooth, uniform flow, making it ideal for the tiny, fine-pitch pads found in modern mobile devices.Melting Point: Operates..

..

 ..

The 2UUL Joint X 158°C (50g) Low-Temperature Solder Paste is an advanced micro-soldering consumable engineered specifically for thermal-sensitive smartphone logic boards, layered motherboards (double-decker sandwich PCBs), and delicate BGA components. Designed to melt cleanly at an exact threshold o..

The 2UUL FS183 Joint X 183°C (50g) Solder Paste is an ultra-fine, professional micro-soldering solder paste engineered specifically for mobile device motherboard repair, CPU/NAND BGA reballing, and high-density SMD component rework. Built on a proven Sn63/Pb37 eutectic alloy ratio with an exact melt..

The 2UUL FS200 Joint X 200°C (50g) High-Temperature Solder Paste is an advanced micro-soldering alloy formulated specifically for high-stress BGA reballing, mobile CPU/GPU installations, and heavy-duty logic board power delivery circuits. Engineered with a specialized silver-bearing alloy profile me..

The 2UUL New Version Tubemate Press Type Auxiliary Putter is an ultra-ergonomic, workshop-grade fluid dispenser booster engineered to replace standard, fatiguing plastic manual syringe plungers. Sold as a convenient 2-Piece Bench Pack, this updated mechanical booster transforms ordinary syringe barr..

..