The FORWARD FW-WX1039 138℃ Ultra-Low Temp Solder Paste – Shield Series is an ultra-fine, low-melting-point micro-soldering alloy paste formulated specifically for delicate smartphone motherboard repair, multi-layer sandwich logic board bonding, and heat-sensitive component rework. Manufactured under Forward's Shield Series standards, this paste liquefies at an exact eutectic threshold of 138°C (Sn42Bi58 alloy formulation), drastically lowering thermal exposure during hot air or heating platform rework to protect adjacent underfilled chips, basebands, and processors from blister damage, bridging, or thermal shock.
Engineered with high-activity, zero-halogen no-clean flux media and micro-spherical powder particles (Type 4 / Type 5 mesh size), the FW-WX1039 delivers continuous, non-drying deposition through stencils. It flows seamlessly onto copper pads and pre-tinned contacts, curing into shiny, low-void solder joints with superior shear strength and high electrical conductivity. The airtight syringe barrel prevents moisture absorption and solder crusting, giving technicians smooth extrusion right down to the last drop.
Key Capabilities & Workshop Advantages
- Accurate 138°C Eutectic Melting Point: Melts cleanly at 138°C, providing the ideal thermal boundary to reball or reflow sandwich motherboards without melting internal 183°C factory BGA chips.
- Thermal Shock Protection: Shields sensitive surrounding components (such as CPU, NAND, and audio ICs) from thermal delamination, pad lift, and solder squeeze-out during hot air heating.
- Fine-Grain Particle Distribution: Uniform micro-spherical powder guarantees smooth stencil release with zero bridging, even across ultra-fine 0.3mm to 0.4mm pitch BGA arrays.
- Balanced Tackiness & Wetting: High-activity flux vehicle rapidly dissolves surface oxide layers on copper pads, providing instant wetting and bright, concave solder joints.
- Resistant to Solder Beading & Splatter: Controlled solvent vaporization eliminates violent boiling and stray solder ball spattering across nearby logic traces.
- No-Clean Inert Residue: Leaves a clear, non-conductive, non-hygroscopic residue that does not induce board corrosion or parasitic micro-current leakage.
- Syringe-Fed Precision Packaging: Packed in a 10cc-class syringe tube with a manual push booster rod and dual dispensing needles, ensuring zero flux waste and mess-free application.
Technical Specification Matrix
Parameter Profile | Specification Details |
Brand & Series | FORWARD – Shield Series |
Product Model | FW-WX1039 |
Alloy Composition | Sn42 / Bi58 (Tin-Bismuth Low-Temperature Alloy) |
Melting Point | 138°C (280.4°F) Eutectic |
Powder Particle Size | Type 4 / Type 5 (Micro-spherical particle structure) |
Flux Chemistry | Halogen-Free, No-Clean, High Surface Insulation Resistance |
Packaging Format | Airtight Syringe Barrel Dispenser |
Residue Type | Clear, non-corrosive, non-conductive |
Dispensing Accessories | Syringe Push Booster Rod + Dual Metal Dispensing Needles |
Primary Compatibility | iPhone X to 16 Pro Max sandwich board separation/bonding, Android mid-frame soldering, heat-sensitive flex cables |
Recommended Bench Workflows
- Double-Decker Sandwich Board Layering: The industry-standard choice for re-attaching middle frames on iPhone (X/11/12/13/14/15/16 series) and high-end Android dual-layer logic boards on heating tables at 160°C–180°C without disturbing bottom-side components.
- Heat-Sensitive Flex & FPC Soldering: Soldering battery FPCs, camera sockets, and delicate plastic-framed connectors without melting plastic retainers or nearby adhesive gaskets.
- Fingerprint & Face ID Sensor Rework: Re-soldering temperature-vulnerable sensor chips, dot matrix illuminators, and ambient light sensors that degrade under standard 183°C or 217°C heat.
- Micro-Jumper & Shield Can Tack Soldering: Tacking RF shield frames or small bypass jumpers to motherboard grounding pads quickly without overheating neighboring RF circuits.
Package Contents:
- 1 × Forward FW-WX1039 138℃ Low Temp Solder Paste
