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Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass

Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
-43 %
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass
  • Stock: In Stock
  • Model: P08
  • Weight: 0.04kg
People Interested: 1111
Rs.199.00
Rs.349.00
Ex Tax: Rs.199.00

Lanrui P08 High temperature Resistant Explosion Proof Solder Tin Gasket Glass


Key Features and Functions:

  • Anti-Splatter Protection: It prevents the formation of uneven solder balls and "bursting" caused by pad oxidation or stencil protrusion during heating.
  • High-Temperature Resistance: Made from ultra-clear, explosion-proof glass, it can withstand extreme heat without cracking, maintaining high thermal conductivity to ensure even heating of the chip.
  • Stencil Stability: It solves the issue of steel reballing meshes bulging or deforming under heat, ensuring a flat surface for precise soldering.
  • Clear Visibility: The transparent glass allows technicians to monitor the soldering process in real-time while protecting the surrounding workspace. 

Technical Specifications:

  • Material: Impact-resistant and heat-resistant ultra-white glass.
  • Size: Standard units are typically around 20x20mm for precision soldering.
  • Durability: Designed to maintain its color and adhesion under high-temperature soldering conditions without peeling.

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