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LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17 PM
Rs.5,499.00
Rs.7,999.00
Ex Tax:
Rs.5,499.00
LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17PM
Features:
- Supports iPhone 11-17 Series, synthetic stone material; Corrosion-resistant and anti-static
- Multi-directional strong magnetic adsorption: The base features a built-in powerful magnet ensuring strong magnetic adhesion, precise positioning, and zero deviation
- 11-17 Series Mid-Layer Tinning Station: Heat Dissipation Vents + Precision Alignment, Tin Planting-Flawless in a Single Step
- High Precision, Precise Positioning, Ensure Accuracy, Minimize Error
- Premium Steel. Precision Crafted: Crafted from carefully selected, high-quality steel, the mesh offers excellent resilience and exceptional durability
Package includes:
iPhone 11-17 Pro Max Complet Set
Tags:
BGA Reballing
, Qualcomm IC
, MediaTek MTK
, CPU Repair Tool
, BGA Stencil
, IC Reballing Tool
, Mobile Motherboard Repair
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