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LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17 PM

LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17 PM
LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17 PM
-31 %
LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17 PM
LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17 PM
LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17 PM
  • Stock: In Stock
  • Model: F20
  • Weight: 0.55kg
People Interested: 36
Rs.5,499.00
Rs.7,999.00
Ex Tax: Rs.5,499.00

LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Tin Plating Platform for iPhone 11-17PM


Features:

  • Supports iPhone 11-17 Series, synthetic stone material; Corrosion-resistant and anti-static
  • Multi-directional strong magnetic adsorption: The base features a built-in powerful magnet ensuring strong magnetic adhesion, precise positioning, and zero deviation
  • 11-17 Series Mid-Layer Tinning Station: Heat Dissipation Vents + Precision Alignment, Tin Planting-Flawless in a Single Step
  • High Precision, Precise Positioning, Ensure Accuracy, Minimize Error
  • Premium Steel. Precision Crafted: Crafted from carefully selected, high-quality steel, the mesh offers excellent resilience and exceptional durability


Package includes:

iPhone 11-17 Pro Max Complet Set


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