The MaAnt MY-38A 138°C (50g) Silver-Containing PPD Solder Paste is an ultra-low-temperature micro-soldering alloy engineered specifically for extreme thermal-sensitive smartphone logic board rework, Face ID dot projector repairs, double-decker sandwich PCB interposers, and delicate flex cable connections. Formulated to liquefy cleanly at an ultra-low threshold of 138°C, the MY-38A drastically reduces thermal exposure during hot-air rework, completely eliminating common repair risks such as PCB blistering, pad delamination, component shifting, and heat-induced lens damage in optical sensor modules.
Unlike standard bismuth-tin low-temp pastes that can result in brittle solder joints, MaAnt infuses the MY-38A alloy matrix with microscopic silver (Ag) particles. This silver-bearing PPD formula enhances electrical conductivity, dampens internal resistance, and delivers robust mechanical shear strength to prevent cold solders, false welds, or micro-fractures under physical drops.
Key Capabilities & Engineering Features
- Ultra-Low 138°C Reflow Profile: Minimizes thermal transfer into delicate multi-layer circuit boards, protecting fragile stacked motherboards and sensitive ICs from high-temperature delamination.
- Silver-Infused Alloy Matrix: Microscopic silver particles reinforce the crystal structure of the low-melt solder, providing superior ductile strength and preventing the brittle fracture common in traditional bismuth-tin alloys.
- Ideal for Face ID & Optical Sensors: Perfect for repairing iPhone Dot Projectors, Infrared Cameras, and Flood Illuminators, where temperatures above 150°C can desolder optical crystals or fracture delicate diffusers.
- Double-Decker Sandwich Board Separation & Re-joining: Serves as the premier alloy for middle-frame interposers, allowing upper and lower boards to bond seamlessly at low temperatures without reflowing internal shielding or adjacent underfilled ICs.
- Micro-Fine Particle Distribution (Type 4, 20–38 µm): Spherical micro-alloy powder provides smooth squeegee printing through precision stencils without clogging apertures, voiding, or splashing during heat reflow.
- Anti-Slumping & Anti-Bridging Viscosity: Holds its precise geometric form in stencil apertures through pre-heating, preventing paste collapse, solder beading, or microscopic shorts between fine 0.3mm–0.4mm pitch pads.
- No-Clean, Non-Corrosive Mild Residue: Leaves high-impedance, transparent residue that poses zero risk of trace corrosion or parasitic leakage. Cleans away quickly with standard PCB cleaner or 99% isopropyl alcohol (IPA).
- Sealed 50g Workshop Packaging: Heavy-duty screw-cap tub with a built-in protective inner seal to prevent moisture absorption and paste desiccation on active repair benches.
Technical Specification Matrix
Parameter Profile | Specification Details |
Brand & Series | MaAnt Professional Repair Series |
Model Code | MY-38A |
Alloy Type | Silver-Containing Ultra-Low Temperature Alloy (Sn-Bi-Ag) |
Melting Point | 138°C (280°F) |
Powder Particle Size | Type 4 (20–38 µm) |
Net Weight | 50g |
Flux Vehicle | Low-Residue High-Activity Synthetic Rosin |
Recommended Hot-Air Temp | 200°C – 230°C (Nozzle setting with low-to-medium airflow) |
Recommended Storage | 0°C – 10°C (Refrigerated) for extended shelf life; bring to room temp before opening |
Target Applications | Face ID prism/dot projector repair, double-decker board sandwiching, camera modules, plastic FPC connectors |
Step-by-Step Low-Temp Reballing & Joining Workflow
- Room Temperature Acclimation: Allow refrigerated containers to rest at room temperature for 1 to 2 hours prior to unsealing to avoid moisture condensation inside the jar.
- Pad Preparation: Remove old oxidized solder from the board pads or interposer frame using a fine desoldering wick and PCB cleaner until pads are uniform, flat, and shiny.
- Align Precision Stencil: Secure a direct-heat or magnetic stencil tightly over the chip or board frame, ensuring perfect aperture registration with zero gap.
- Scrape Paste Smoothly: Apply a small bead of MaAnt MY-38A and scrape firmly across the stencil apertures at a 45° angle using a stainless spatula. Ensure all apertures fill evenly and scrape off excess paste.
- Low-Heat Reflow: Set your rework station to 200°C–230°C with low airflow. Direct the nozzle 2 cm perpendicularly above the stencil, swirling in small circular motions until the paste melts into uniform, mirror-bright solder spheres.
- Cool & Release: Allow the part to cool for 15 seconds. Moisten lightly with PCB cleaner or IPA, gently detach the stencil, and inspect under a microscope for consistent ball formation.
Package Contents:
- 1 × MaAnt MY-38A 138°C Silver-Containing Low-Temperature Solder Paste (50g )
