AMAOE M15 SOLDER PASTE 138°C 20g Medium Low Temperature Welding Paste For Mobile Phone PCB BGA CPU Repair Tools

Formulated with a refined Sn42Bi58 eutectic lead-free alloy melting sharply at 138°C, this paste dramatically lowers thermal requirements on the bench. It safeguards delicate internal structures against common heat-induced failure modes—such as inner CPU underfill bubbling, motherboard delamination, and warped plastic FPC connector housings—while delivering strong mechanical bonding and high electrical conductivity.

Key Engineering Features & Bench Advantages:

• Pinpoint Needle-Tip Dispensing: Syringe barrel and plunger system allow accurate micro-dot placement onto tiny SMD pads, FPC battery pins, and trace jumpers without solder bridges onto adjacent grounding planes.
• Eutectic 138°C Melting Point: Transitions from solid to liquid at a low thermal threshold, safeguarding surrounding underfill, baseband chips, and plastic connectors from reflow heat damage.
• Double-Decker Motherboard Rebonding: Tailored for layered PCB assemblies (such as iPhone X through recent flagship series and multi-tier Android boards), allowing seamless middle-frame rebonding on heating platforms without disturbing inner-layer BGA arrays.
• Anti-Oxidation Syringe Barrel: Airtight seal prevents flux solvent evaporation and crust formation, keeping the paste creamy, pliable, and ready to dispense over months of bench use.
• Anti-Splatter & Low-Residue Flux Carrier: Formulated to suppress flux boiling and explosive spatter during rapid heating, preventing stray tin beads from bridging micro-passives (0201/01005).
• Easy Post-Soldering Cleanliness: Yields bright, uniform solder joints with minimal clear, non-conductive residue that cleans up easily with an ESD brush and 99% isopropyl alcohol (IPA).

Technical Specification Matrix

Bench Application & Usage Guide:

1. Pad Preparation: Clean the bonding pads or interposer frame using desoldering wick and flux to leave a flat, clean surface. Wipe thoroughly with 99% IPA.
2. Precision Dispensing: Secure the fine needle tip onto the luer-lock syringe. Depress the plunger to extrude tiny micro-dots directly onto component pads, or apply an even bead across a middle-frame BGA stencil.
3. Heating Platform Rebonding (Double-Decker Boards): Place the reballed sandwich board assembly onto a dedicated heating platform. Set target temperature to 170°C–185°C. The M15 paste will reflow cleanly around 140°C–150°C, aligning the board halves without melting inner CPU underfill.
4. Hot Air Spot Reflow: When soldering delicate FPC sockets or small ICs, set your hot air station to 220°C–240°C with low airflow (20–30%). Keep the nozzle in a gentle circular motion until the solder paste draws into bright, uniform joints.
5. Post-Rework Cleaning: Allow the logic board to cool to room temperature. Clean surrounding flux with an ESD brush and 99% IPA for a spotless, factory-grade inspection finish.