Amaoe MI9 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 845 / 710 / SDM845 / 710 Xiaomi 8 / 8SE / MIX 2S
Rs.180
Ex Tax:
Rs.180
Amaoe MI9 0.12mm BGA Reballing Stencil for Qualcomm Snapdragon 845 / 710 / SDM845 / 710 Xiaomi 8 / 8SE / MIX 2S
We also recommend
MIJING BGA Stencil is a High Precision BGA Rebelling TemplateCompatible with iPhone 7, 7 PlusCan be used with direct heat.This is a required tool for ..
Rs.249
Ex Tax:Rs.249
amao-hi1-bga-reballing-stencil-for-huawei-hi6421-hi6523-hi6551-6555-6521m-hi6561-hi6422-6553-hi6921..
Rs.180
Ex Tax:Rs.180
..
Rs.199
Ex Tax:Rs.199
New
Amaoe 0.12mm 4-in-1 Screen LCD IC BGA Reballing Stencil for iPhone X to 15Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199
Amaoe 0.12mm Baseband/Hard Disk/WiFi/NFC/Chip Board Carrying BGA Reballing Stencil for iPhone 7 to 14Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199From the same brand
10in1 Double-headed multi-function prying knife Set..
Rs.300
Ex Tax:Rs.300amao-hi1-bga-reballing-stencil-for-huawei-hi6421-hi6523-hi6551-6555-6521m-hi6561-hi6422-6553-hi6921..
Rs.180
Ex Tax:Rs.180
New
Amaoe 0.12mm 4-in-1 Screen LCD IC BGA Reballing Stencil for iPhone X to 15Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199Amaoe 0.12mm Baseband/Hard Disk/WiFi/NFC/Chip Board Carrying BGA Reballing Stencil for iPhone 7 to 14Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199