Amaoe U-QSD6 BGA Reball Stencil For Qualcomm CPU SM8150/ SM7150/ SDM845/ RAM556/ BGA254/ 56023/ SDR845/ PM845/ BGA153/ SDR8150/ PM8150/ SDR660/ PM7150A/ PM8150A/ PM8150B
The Amaoe U-QSD6 BGA Reballing Stencil is a premium, high-precision chip-level repair template engineered specifically for Android motherboard technicians. Designed by Amaoe, the industry standard for micro-soldering consumables, this stencil features exact laser-cut square holes to ensure uniform solder ball formation on high-density Qualcomm Snapdragon CPUs (SM8150, SM7150, SDM845) and matching RAM556 memory layers.
Manufactured from premium, high-temperature resistant stainless steel, this stencil is built to withstand direct heat from hot air rework stations without warping, buckling, or causing frustrating solder bridges on your workbench.
Key Features & Bench Advantages:
- Flawless Square-Hole Matrix: Features Amaoe's signature precision-cut square holes, which release solder paste much more easily than cheap round-hole stencils, ensuring perfectly uniform solder balls.
- Anti-Warping Thermal Stability: Built from premium-grade stainless steel that resists deformation and heat-buckling during intense CPU and RAM chip reflow cycles.
- Dual-Layer Sandwich Alignment: Designed with dedicated grids to handle the precise alignment pins for both the base Qualcomm processor and the top-mounted RAM layer (RAM556).
- Exact 0.12mm Thickness: Engineered to the ideal depth to prevent over-flooding of solder paste, giving you clean, short-circuit-free chip seating on the first try.
Technical Specification Matrix
Parameter Profile | Factory Specification Details |
Brand Developer | Amaoe (High-Precision Series) |
Model Number | U-QSD6 |
Stencil Thickness | 0.12 mm |
Hole Design Type | Precision Laser-Cut Square Holes |
Material Composition | High-Temperature Anti-Deformation Stainless Steel |
Supported CPUs | Qualcomm Snapdragon SM8150 / SM7150 / SDM845 |
Supported RAM Layer | RAM556 Matrix Configuration |
Supported Chipset Profiles:
- SM8150: Qualcomm Snapdragon 855 / 855 Plus CPU
- SDM845: Qualcomm Snapdragon 845 CPU
- SM7150: Qualcomm Snapdragon 730 / 730G CPU
- RAM556: Matching LPDDR4X / LPDDR5 Memory ICs
Pro-Technician Reballing Tips:
- Clean thoroughly: Ensure the Qualcomm IC is completely free of old underfill glue and residual lead-free solder before placing the stencil.
- Apply evenly: Use a high-quality mid-temperature solder paste (like 183°C) and wipe off any excess paste cleanly from the Amaoe plate.
- Control your air: Set your hot air rework station to a lower, stable airflow setting (around 250°C–280°C depending on your station) to prevent blowing the paste out of the alignment grid before it liquefies.
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