AMAOE M14 SOLDER PASTE 183°C 20g Medium Low Temperature Welding Paste For Mobile Phone PCB BGA CPU Repair Tools

Formulated with a classic Sn63/Pb37 eutectic alloy melting at 183°C, the M14 delivers balanced mechanical shear strength and thermal reliability. Its micro-fine spherical powder and non-boiling flux vehicle ensure smooth, mirror-bright joints, preventing bridging, explosive solder splatter, and cold joints during hot air reflow on dense smartphone logic boards.

Key Engineering Features & Bench Advantages:

• Micro-Needle Syringe Dispensing: The 20g syringe format allows pinpoint micro-dot placement directly onto jumper pads, test points, charging dock pins, and micro-FPC sockets without contaminating adjacent circuits.
• Airtight Storage & Extended Shelf Life: Eliminates atmospheric exposure and crust formation, keeping the flux matrix fresh, tacky, and ready to dispense down to the last gram.
• 183°C Eutectic Melting Point: Transitions cleanly between solid and liquid phases, forming high-tensile solder joints that withstand physical board drops and vibration far better than low-temperature bismuth alloys.
• Ultra-Fine Spherical Powder Matrix: Atomized alloy particles glide smoothly through fine-pitch BGA stencil apertures (0.12mm–0.15mm) without clumping or clogging needle tips.
• Anti-Tin-Bead & Non-Spatter Flux Vehicle: Advanced organic carrier prevents boiling and explosive flux expansion under rapid hot air heating, keeping loose tin beads from lodging under nearby ICs.
• Clear, Low-Residue Formulation: Leaves minimal, non-conductive, clear rosin residue that cleans off quickly with 99% isopropyl alcohol (IPA) and an ESD brush. 

Technical Specification Matrix

Bench Application & Usage Guide:

1. Pad Preparation: Clean oxidized solder pads using a copper desoldering wick and flux. Wipe clean with 99% IPA to remove dirt and carbonization.
2. Precision Dispensing: Attach the blunt needle tip to the syringe. Depress the plunger to apply micro-droplets directly onto connection pads, or extrude a line across a BGA stencil for spreading with a scraper blade.
3. Hot Air Reflow: Set your hot air rework station to 280°C–310°C with low airflow (25–35%). Keep the nozzle moving in gentle circles 1.5–2 cm above the workpiece. The alloy will liquefy at 183°C into uniform, bright solder spheres. 
4. Post-Soldering Cleanup: Allow the board to cool below 80°C. Clean remaining flux residue with a soft ESD brush and 99% IPA for a spotless, factory-grade finish.