RELIFE RL-403S MEDIUM TEMPERATURE SYRINGE PASTE

The RELIFE RL-403S Medium Temperature (183°C / 10cc) Syringe Solder Paste is an ergonomic, zero-waste micro-soldering solution engineered specifically for mobile phone motherboard repair, BGA reballing, and high-precision SMD point dispensing. Unlike traditional tub-based solder pastes that dry out when exposed to air and require separate spatulas, the RL-403S comes pre-packaged in a sealed 10cc syringe barrel complete with an ergonomic push plunger and interchangeable needle tips, delivering pinpoint application directly to fine-pitch solder pads.

Formulated around an industry-standard Sn63/Pb37 eutectic alloy with a sharp melting threshold of 183°C, this medium-temperature paste ensures rapid, uniform wetting and high-strength metallurgical bonding without subjecting delicate ICs to excessive heat. Its refined Type 4 powder (20–38 µm) micro-spheres eliminate clogging inside narrow dispensing nozzles and prevent solder bridging on tightly spaced CPU, baseband, and power management IC (PMIC) pads.

Key Capabilities & Engineering Features

• Precision Syringe Dispenser with Pusher: Eliminates paste waste and bench mess. The included plunger and needle nozzles allow technicians to deposit microscopic dots directly onto component pads, jumper wires, or stencil apertures with one-handed control.
• Stable 183°C Eutectic Melting Point: Sharp solid-to-liquid transition provides predictable reflow cycles, eliminating pasty intermediate states and preventing cold solder joints during hot-air rework.
• Extended Open-Air Wetting Retention: Engineered with active anti-drying agents—maintains consistent viscosity and workable tackiness on the bench without skinning over or hardening.
• High-Purity Type 4 Particle Profile (20–38 µm): Uniform spherical tin-lead alloy particles ensure smooth extrusion through fine-gauge needles and clean filling into micro-stencil cutouts.
• Strong Deoxidation & Active Wetting: Dissolves oxide films on copper, nickel, and gold surfaces instantly, producing bright, full, and highly conductive solder joints with minimal spatter.
• Clean, Non-Corrosive Mild Residue: Leaves high-impedance, transparent residue that does not induce electrical leakage or corrode motherboard traces. Cleans away effortlessly with standard PCB cleaner or 99% isopropyl alcohol (IPA).

Technical Specification Matrix

Dual-Use Bench Workflow Guide

Method A: Direct Point-Dispensing (Jumper Wires & FPC Connectors)

1. Remove the protective front plug from the syringe and twist on the desired gauge needle tip.
2. Insert the rear plunger pusher into the back of the syringe tube.
3. Gently press the plunger to dispense microscopic dots of paste directly onto small solder pads, broken trace jumpers, or battery connector terminals.
4. Touch the joint with a micro-soldering iron tip or warm briefly with hot air (280°C–300°C on low airflow) to instantly form a bright, solid connection.

Method B: Stencil Reballing (BGA Chips)

1. Depress the plunger to extrude a small bead of RL-403S directly onto the surface of a direct-heat or magnetic reballing stencil.
2. Use a flat micro-soldering scraper to spread the paste across all apertures in a single firm 45-degree pass.
3. Apply hot air evenly in circular motions until the paste reflows into shiny, uniform solder spheres across the entire BGA ball grid.
4. Allow the chip to cool, release it from the stencil, and wipe clean with PCB cleaner.

Package Contents:

• 1 × RELIFE RL-403S 183°C Solder Paste (10cc Syringe)
• 1 × Ergonomic Manual Plunger Pusher
• 2 × Precision Dispensing Needle Tips (Assorted Gauges)