- Stock: In Stock
- Model: Blade 4
- Weight: 0.02kg
The Hong Hai Tong 4 No. IC Glue Removal Blade for Mobile Motherboard Repair is an ultra-thin, high-elasticity micro-blade engineered specifically for clearing tough epoxy resin, black underfill glue, edge sealant, and UV mask from delicate smartphone logic boards. Manufactured from refined high-carbon spring steel, the No. 4 blade profile features an optimized angled spatula-hook tip that allows technicians to slice and lift softened glue around dense CPU, NAND flash, baseband, and power IC perimeters without scraping off delicate solder mask or ripping surface-mount copper pads.
Modern smartphone motherboards (such as multi-layer iPhone and dense Android boards) utilize rigid, heat-cured underfills to protect microchips from drop damage. Standard hobby scalpels or thick razor blades easily dig into the PCB laminate, severing internal circuit traces. The Hong Hai Tong No. 4 blade combines hand-polished beveled edges with flexible lateral compliance, gliding safely along the board plane under hot air heating to peel away cured glue effortlessly.
Key Engineering Features & Bench Advantages:
- No. 4 Angled Precision Contour: Specifically contoured for corner clearing and edge sealant trenching, slicing through perimeter adhesive dams around BGA chips without contacting adjacent 01005 passives.
- Ultra-Thin Spring Steel Core: Offers calibrated elastic flexibility that bends slightly under hand pressure rather than biting into the fiberglass substrate or exposing internal copper ground planes.
- Hand-Polished Non-Scratch Edge: Ground to a micro-beveled finish that shears hot, softened underfill glue cleanly without scratching surrounding gold/copper pads or slicing through flexible jumper wires.
- High Thermal Resilience: Does not lose its temper, warp, or soften when used directly under continuous hot air stream temperatures (240°C–280°C).
- Universal Collet Compatibility: Standard slotted blade shank fits securely into all standard micro-craft handles, rotary collets, and dedicated Hong Hai Tong / Mechanic / Relife glue removal handles.
- Corrosion & Oxidation Resistant Coating: Treated to resist tarnishing and chemical erosion from active rosin flux, PCB cleaners, and 99% isopropyl alcohol (IPA).
Technical Specification Matrix
Parameter Profile | Product Specification Details |
Product Brand | Hong Hai Tong (HHT) |
Model / Profile | No. 4 Angled Glue Removal Blade |
Primary Material | High-Grade Elastic Spring Steel / High-Carbon Alloy |
Blade Thickness | Ultra-Thin (~0.10mm – 0.12mm) |
Thermal Tolerance | Continuous operation up to 300°C under hot air rework |
Handle Compatibility | Universal collet chucks, standard micro-knife handles |
Primary Bench Applications | Edge glue cutting, BGA underfill cleanup, CPU corner clearing, sandwich board glue peeling |
Bench Application & Usage Guide:
- Handle Mounting: Insert the No. 4 blade shank into your micro-knife chuck and tighten the threaded brass/aluminum collar securely to eliminate tip wobble.
- Thermal Softening: Set your hot air rework station to 240°C–260°C with moderate airflow. Warm the perimeter of the targeted IC (CPU, NAND, or PMIC) for 15–20 seconds to soften the epoxy underfill.
- Corner & Trench Clearing: Angle the No. 4 blade tip at approximately 30° to the board surface. Glide the tip along the IC perimeter trench, slicing the softened sealant away from nearby micro-resistors and capacitors.
- Under-Chip Prying (Post-Reflow): Once all solder balls have liquefied, use the flat underside of the blade as a low-profile lifting wedge at an IC corner to gently pry the chip up without tearing motherboard pads.
- Post-Cleanup: After chip removal, apply hot air and sweep the blade across the residual pad glue to peel it away cleanly. Wipe down the logic board with 99% IPA and an ESD brush.
