The Hong Hai Tong HHT G7 Blade Handle Set For Phone CPU IC Glue Removing is a master-tier micro-soldering hand tool system engineered for delicate underfill clearing, edge resin trenching, and chip-level prying on dense smartphone motherboards. Combining an ergonomically balanced, heat-insulated anti-static handle with 6 specialized ultra-thin spring steel blades (1# through 6#), the HHT G7 provides the micro-mechanical versatility required to safely disassemble everything from small passive arrays and Wi-Fi modules to tiered sandwich CPUs without scratching PCB solder masks or tearing copper landing pads.
Modern smartphone logic boards utilize rigid, heat-cured black and clear epoxy underfills to resist drop shock. Using standard thick craft blades or rigid pry bars frequently transfers heat to the user's fingers, slips off pads, and severs microscopic internal circuit traces. The HHT G7 handle utilizes specialized composite materials that block thermal conduction from hot air stations, while the hand-polished, ultra-flexible blade profiles glide smoothly along the board plane under heat to cleanly shear softened adhesive.
Complete 6-in-1 Blade Profile Breakdown:
- 1# Blade (Small IC & Base Perimeter): Tailored for removing hardened glue around small-footprint ICs (audio codecs, charging ICs, small PMICs) and tight peripheral clearances.
- 2# Blade (Large BGA & Power ICs): Designed for wide-sweep glue removal and flat surface scraping on larger BGA components, main PMICs, and logic power sections.
- 3# Blade (Single & Double-Layer CPU Disassembly): Engineered specifically for layered logic board separation, prying, and underfill slicing on multi-tier CPU and RAM sandwich assemblies (A-series / Snapdragon).
- 4# Blade (Android Font & Intermediate ICs): Contoured for Android font ICs, baseband controllers, and universal chip edge-sealant trenching.
- 5# Blade (Hook & Corner Trench Scraping): Distinctive curved radius hook geometry crafted to reach into tight perimeter chip gaps, dragging and scooping softened glue out of crowded corner margins.
- 6# Blade (NAND Flash & Wi-Fi IC Prying): Optimized spatula edge engineered to safely slide underneath NAND Flash chips, Wi-Fi/Bluetooth modules, and wide baseband chips for clean, pad-safe lifting.
Key Engineering Features & Bench Advantages:
- Thermal-Insulating Composite Handle: Manufactured from imported heat-resistant materials that prevent heat conduction from continuous hot air rework (250°C–320°C), keeping the grip cool and comfortable during prolonged scraping sessions.
- Anti-Static & ESD-Safe Construction: Eliminates electrostatic discharge risks when operating around ultra-sensitive CMOS components, application processors, and baseband logic.
- Ultra-Thin Elastic Spring Steel: High-carbon spring steel blades offer subtle lateral flexibility, flexing safely under hand pressure rather than biting into fiberglass laminates or scoring internal ground traces.
- Precision Zero-Wobble Collet Chuck: Threaded locking collet holds each blade shank perfectly centered and rigid, preventing unwanted rotational play during delicate microscope maneuvers.
- Hand-Polished Non-Scratch Bevels: Graded scraping edges cut and roll softened underfill away without slicing surface copper traces, stripping green mask, or lifting delicate jumper wires.
Technical Specification Matrix
Parameter Profile | Product Specification Details |
Product Brand | Hong Hai Tong (HHT) |
Model Number | HHT G7 (HHT-G7) |
Kit Configuration | 1x Heat-Insulating Handle + 6x Specialized Interchangeable Blades (1#–6#) |
Handle Material | High-Temperature Resistant, Non-Conductive Anti-Static Composite |
Blade Metallurgy | High-Elasticity Spring Steel / High-Carbon Alloy |
Blade Thickness | Ultra-Thin (~0.10mm – 0.12mm) |
Thermal Limit | Heat-resistant up to 300°C under continuous hot air flow |
Primary Applications | Phone CPU Glue Removal, NAND Flash Disassembly, Wi-Fi IC Prying, Corner Trenching |
Bench Application & Usage Guide:
- Blade Selection & Installation: Choose the numbered blade that matches your target component (e.g., 3# for CPU sandwich separation, 5# for corner trenching, or 6# for NAND flash). Loosen the handle collet, seat the blade tang flush into the slot, and firmly tighten the locking collar.
- Thermal Softening: Direct your hot air rework station (240°C–260°C, low-medium airflow) at the perimeter of the targeted IC for 15–20 seconds to soften the epoxy resin.
- Perimeter Trenching: Using blade 1#, 4#, or 5#, glide the edge along the chip trench to slice and rake away softened underfill, ensuring adjacent 0201/01005 passives are separated from the chip edge.
- Chip Prying & Separation: Increase hot air to reflow temperature (300°C–330°C). Once solder balls liquefy, insert the ultra-thin tip of blade 2#, 3#, or 6# into the corner of the chip. Gently apply upward levering force—the chip will lift smoothly without tearing pads off the board laminate.
- Pad Cleanup: Sweep the blade across the hot residual glue on the board surface to roll away leftover adhesive. Allow the board to cool, then clean with an ESD brush and 99% IPA.
