The Qianli 007 Edge Glue Remover Replacement Blade (Blade Only) is a hand-polished, ultra-thin consumable refill engineered for component-level smartphone motherboard technicians. Designed to seamlessly fit your existing Qianli universal precision handles (such as the 012 or iHilt series), this specialized crescent blade allows you to restock your workbench with factory-fresh cutting edges without the added expense of buying a completely new handle kit.
Crafted from premium, high-elasticity steel, the blade features a specialized curved geometry optimized for carving out hardened black epoxy and underfill resins from the borders of delicate surface-mount components. It offers the perfect mechanical balance of flexibility and strength, enabling you to glide around dense IC arrays under a microscope without scraping away underlying copper traces or gouging the solder mask.
Key Engineering Features & Bench Advantages:
- High-Elasticity Steel Matrix: Stamped from thin, specialized alloy steel that maintains its memory when flexed. This allows you to apply controlled structural pressure underneath chips without snapping the tip.
- Hand-Polished Crescent Edge: Each blade undergoes custom edge-dressing to provide a burr-free, low-friction profile. It easily slices through tough factory adhesives at lower thermal thresholds.
- Safe Trace Defense Geometry: Engineered with an optimal curvature that prevents the sharp corners of the blade from digging into the multi-layered PCB substrate, radically lowering the risk of accidental track delamination.
- Cost-Efficient Bench Refill: Provided as a standalone blade module, allowing high-volume refurbishing labs to swap out dulled or heat-worn tips quickly to maintain peak cleaning efficiency.
- Universal Tool Compatibility: Designed to seat securely into standard 0.1mm micro-blade collets, ensuring zero side-wobble or loose shifting while executing intense side-glue scrapes.
Technical Specification Matrix
Parameter Profile | Component Specification Details |
Brand / Manufacturer | QIANLI TOOLPLUS Precision Tools |
Product Line | Specialized BGA Rework Series |
Model Designation | 007 Replacement Refill Variant |
Blade Profile Shape | J-Curved / Crescent Side-Scraper Profile |
Thickness Configuration | Ultra-Thin 0.1mm Clearance Depth |
Material Build | Hand-Polished High-Grade Flexible Alloy Steel |
Packaging Layout | Standalone Single Refill Unit (Handle Not Included) |
Primary Bench Utility | Black Underfill Scraping, Side Frame Epoxy Clearing, IC Reball Prep |
Recommended Bench Operation Guide:
- Collet Installation: Loosen the knurled locking chuck on your compatible precision handle. Slide the flat base of the Qianli 007 blade completely into the receiving slot and torque the collar down firmly until it locks with zero play.
- Thermal Activation: Use your hot air rework station to warm the perimeter of the targeted chip (typically between 180°C and 220°C depending on your specific board setup) to soften the factory epoxy seal.
- Low-Profile Entry: Hold the handle at a shallow angle relative to the circuit board. Insert the curved face of the blade gently between the body of the IC and the neighboring chip components.
- Fluid Scrape Execution: Work the crescent tip smoothly along the side rails of the processor, using a light sawing or pushing action to clear away the softened underfill debris cleanly.
- Tip Inspection: Regularly clean the hot blade against a brass wire sponge to remove melted adhesive buildup. Inspect the edge configuration under your microscope; if the tip becomes bent or nicked, swap it out for a fresh refill module immediately.
