-28 %
Brand: MIJING
Model: Iph-7
MIJING BGA Stencil is a High Precision BGA Rebelling TemplateCompatible with iPhone 7, 7 PlusCan be used with direct heat.This is a required tool for rebelling ice's.This product is small and strong...
Rs.180 Rs.249
Ex Tax:Rs.180
New
Model: OnePlus 10 Pro
..
Rs.199
Ex Tax:Rs.199
New
Brand: AMAOE
Model: IP-17
Amaoe 0.12mm Baseband/Hard Disk/WiFi/NFC/Chip Board Carrying BGA Reballing Stencil for iPhone 7 to 14Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199
New
Brand: AMAOE
Model: SM6450
Amaoe 0.12mm Snapdragon 6 Gen 1 / SM6450 CPU Universal Series BGA Reballing Stencil for Honor X50Package includes:1 x Stencil..
Rs.199
Ex Tax:Rs.199
Brand: AMAOE
Model: SDM-439
SM8250 SM8150 RAM BGA Stencil 855 Upper Layer IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole.Amaoe High Quality BGA Reballing Stencil for Qualcomm SDM439 CPU Steel mesh 0.12mm With Magnetism.SM8250 CPU Bottom Layer BGA Stencil Reballing IC Pin Soldering Tin Plant Net Heating Template 0.12m..
Rs.250
Ex Tax:Rs.250
Brand: AMAOE
Model: BGA-178
Amaoe BGA Stencil For DDR BGA178 Reballing Set IC Chip Soldering..
Rs.350
Ex Tax:Rs.350
Brand: AMAOE
Model: Amaoe EU:5
Amaoe EU:5 CPU BGA Reballing Stencil for Exynos 1080/2100/9815/9609/1080 RAM/2100 RAM/Samsung 3830Amaoe EU:5 CPU BGA Reballing Stencil for Exynos 1080Exynos 2100Exynos 9815Exynos 9609Exynos 1080 RAMExynos 2100 RAMSamsung 3830 XGOExynos 8895-1703Package includes:1 x Stencil..
Rs.250
Ex Tax:Rs.250
New
Brand: AMAOE
Model: IPX 12
Amaoe IPX-12 BGA Reballing Stencil Screen Touch IC Chip Soldering Location Platform Tin Plant Net Welding Steel Mesh..
Rs.199
Ex Tax:Rs.199