The FONEKONG 158℃ Melting Point Special Solder Paste for BGA Reballing (42g / Model FK-158 / FKGL42) is an engineered intermediate-temperature micro-soldering alloy paste formulated specifically for smartphone sandwich logic board reconstruction, fine-pitch BGA reballing, and delicate SMD maintenance. Operating at the 158°C thermal threshold, this specialized alloy bridges the mechanical gap between lower-temperature 138°C/148°C pastes and traditional 183°C eutectic solder, delivering higher tensile fatigue resistance without exposing sensitive chips to excessive heat.
Designed primarily for double-decker motherboard separation and rebonding (such as iPhone multi-tier logic boards and high-density Android flagships), FONEKONG 158°C allows the middle interposer frame to fuse securely on heating platforms while keeping underlying factory CPU, baseband, and power IC joints completely stable and undisturbed.
Key Engineering Features & Bench Advantages:
- Targeted 158°C Middle-Layer Melting Point: Forms durable interposer joints well below the 183°C liquefaction point of internal factory BGA balls, preventing underfill rupture and accidental micro-bridging on lower logic layers.
- Enhanced Ductility & Mechanical Shear Strength: Significantly reduces joint brittleness compared to standard 138°C tin-bismuth pastes, withstanding everyday phone drops, chassis torsion, and vibration.
- Ultra-Fine Micro-Particle Spherical Alloy: Smooth, uniform powder consistency ensures effortless penetration through 0.12mm–0.15mm BGA stencils without clogging apertures or tearing during stencil separation.
- Non-Boiling & Anti-Tin-Bead Flux Matrix: Formulated with an active organic carrier that resists rapid boiling and flux spatter, preventing stray tin beads from bridging tiny 0201/01005 passives.
- Strong Wetting & Oxidation Clearing: Rapidly strips oxide layers from copper, gold, and nickel-plated PCB pads, yielding bright, uniform solder spheres with clean meniscus profiles.
- Low-Residue, Non-Conductive Cleaning: Post-reflow flux residue remains clear, non-corrosive, and non-conductive, washing away easily with 99% isopropyl alcohol (IPA) and an ESD brush.
Technical Specification Matrix
Parameter Profile | Product Specification Details |
Product Model | FONEKONG FK-158 / FKGL42 Special Solder Paste |
Melting Temperature | 158°C (316.4°F) |
Net Weight | 42g Bench Pot |
Particle Size Grade | Micro-Fine Spherical Powder (Fine-Pitch BGA Ready) |
Flux Vehicle Classification | No-Clean, Low-Residue Active Rosin Matrix |
Packaging Type | Airtight Sealed Screw-Top Pot |
Recommended Heating Sources | Heating Platforms / Preheaters, Hot Air Rework Stations |
Primary Bench Applications | Double-Decker Sandwich Board Rebonding, CPU Reballing, Middle-Frame Tinning |
Bench Application & Usage Guide:
- Pad Preparation: Remove residual alloy from the interposer or IC pads using desoldering wick and flux. Thoroughly degrease the area with 99% IPA.
- Stencil Application: Align your dedicated BGA stencil squarely over the chip or middle frame. Spread a small portion of FONEKONG 158°C paste across the apertures using a flat scraping blade at a 45° angle until every opening is evenly packed flush.
- Oil Equalization: For high-density micro-soldering, lightly dab the stencil surface with a lint-free wipe to absorb excess flux oils before applying heat.
- Controlled Reflow:
- For Double-Decker Heating Platforms: Set your preheating bed to 185°C–200°C. The 158°C paste will fuse cleanly around 165°C–170°C without melting the inner CPU/NAND underfill.
- For Direct Hot Air Reballing: Set your rework station to 260°C–290°C with low airflow (25–30%). Hover the nozzle 1.5–2 cm above the stencil in continuous circular passes until uniform, shiny solder spheres form.
- Post-Reflow Cleanup: Allow the board to cool below 80°C. Clean remaining flux residue with an ESD brush and 99% IPA for a spotless, factory-grade finish.
