V1S Pro BGA110 NAND Module for iPhone 8 - 13 Pro Max / SE 2 / iPad 8 / 9 / Air 3 / 4 / Mini 5 / 6 / iPad Pro 3 / 4 / 5

The JCID V1S Pro BGA110 NAND Programmer Module is a professional diagnostic and read/write socket module engineered for chip-level micro-soldering labs, smartphone refurbishment facilities, and logic board repair centers. Serving as the primary workhorse module for the flagship JCID V1S Pro programmer, this unit delivers low-level hardware access to high-volume Apple BGA110 NVMe NAND flash memory chips spanning the Apple A11 Bionic through A15 Bionic architectures.

Engineered to tackle frequent motherboard faults—including NAND data corruption, boot-loop hangs, Wi-Fi hardware encryption locks, and persistent iTunes restore error codes (Error 9, Error 14, Error 4013, Error 4014)—this module is also the primary bench equipment for high-margin storage upgrades (e.g., boosting 64GB or 128GB handsets up to 256GB or 512GB). Equipped with a zero-insertion-force clam-shell bed and precision-spaced, gold-plated pogo pins, it provides rapid, stable bus communication without requiring pre-tinning or damaging microscopic chip contacts.

Key Engineering Features & Bench Advantages:

• SYSCFG Data Read / Write / Backup: Read, extract, modify, and flash factory System Configuration (SYSCFG) data—including device Serial Number, Country/Region codes, Bluetooth MAC, Wi-Fi MAC, and battery telemetry calibration tables.
• One-Click Wi-Fi Unbind: Instantly decouples the encrypted Wi-Fi address within the NAND SYSCFG sector, allowing direct replacement of damaged Wi-Fi 6 modules without desoldering or replacing CPU/EEPROM chipsets.
• High-Volume Storage Upgrades: Format, repartition, and flash donor or brand-new BGA110 NVMe NAND chips to upgrade internal capacity across iPhone 8 through 13 Pro Max and modern iPads.
• Zero-Damage Clam-Shell Test Socket: Features industrial-grade, spring-loaded gold contact pins within an alignment-molded socket bed, delivering high-speed data transmission while preventing mechanical wear or pad delamination on raw NAND chips.
• Dual Interface Operation: Works standalone directly via the V1S Pro touchscreen interface or in tethered mode with the JCID Repair Assistant PC software suite for automated cloud backups and deep partition editing.
• NVMe Error Code Resolution: Formats damaged or corrupted raw partition blocks to clear storage-induced iTunes restore errors, including Error 9, Error 28, Error 4013, and Error 4014.

Technical Specification Matrix

Recommended Bench Operation Guide:

1. Module Docking: Power off or put the JCID V1S Pro in standby mode. Align the BGA110 module with the secondary expansion slot on the programmer and press down gently until the gold-plated header seats firmly.
2. NAND Removal & Pad Prep: Desolder the target BGA110 NAND from the motherboard using hot air set to 345°C–355°C with suitable heat shielding over adjacent components. Clean underfill and residual solder from the chip's pads using a soldering iron with desoldering braid and high-purity PCB cleaner until all pads are completely flat.
3. Socket Placement: Release the clam-shell latch on the BGA110 module. Align Pin 1 on the NAND chip with the alignment dot on the socket tray, place the chip flat onto the contact pins, and clamp the latch shut.
4. Data Read & Backup: Open the "BGA110 NAND" application on the V1S Pro display (or open JCID Repair Assistant on your PC). Click Read to pull the device's SYSCFG information and save a backup copy locally.
5. Modification / Upgrade:
• For Wi-Fi replacement: Click Unbind Wi-Fi to clear the encryption lock from the data string.
• For storage upgrades: Insert the upgraded capacity blank or donor NAND, click Format, and write the saved SYSCFG configuration back onto the flash partition.
6. Reballing & Board Installation: Reball the NAND using a 0.12mm BGA110 stencil and 183°C leaded solder paste. Solder the chip back onto the logic board at 335°C–345°C, allow the board to cool, and perform a full DFU restore via 3uTools or iTunes.